| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel curable resin composition capable of being especially preferably utilized for use of an electronic part such as a protective film material or an electric insulation material of a solder resist and an interlayer dielectric, a sealing material for IC and ultra-LSI, and a material for a laminated board since a cured product being excellent in flexibility, a low warpage property, insulation reliability and burning-resistance can be easily manufactured. <P>SOLUTION: The curable resin composition contains a phenolic hydroxyl group-containing polyurethane (A1) in which a phenolic hydroxyl group-containing unit is bonded in the molecule by a urea bond and a compound (A2) having a functional group capable of being reacted with the phenolic hydroxyl group. <P>COPYRIGHT: (C)2010,JPO&INPIT |
