| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problem: vacuum of a cavity in an electronic device package is not easily measured. <P>SOLUTION: The vacuum inspection device is manufactured, wherein the vacuum inspection device inspects vacuum on a semiconductor wafer containing the electronic device packages in order to inspect an airtight state of the electronic device package in which a base substrate and a lid substrate having a cavity part are joined in a state that both of the substrates face the cavity. Thus, the vacuum of the package under conditions equal to those of the electronic device package can be measured. The vacuum inspection device is structured by arranging the base substrate, the lid substrate joined to the base substrate and facing the base substrate, a metal thin film resistance arranged in the cavity formed between the base substrate and lid substrate, and a through electrode for conducting the metal thin film resistance to an external electrode. <P>COPYRIGHT: (C)2010,JPO&INPIT |
