| 摘要 |
An ultrasonic imaging system wherein an exemplary system includes an array of transducer elements arranged along a first plane for transmitting first signals and receiving reflected signals for image processing. Circuit structures each have a major surface positioned in a co-planar orientation with respect to a major surface of another of the circuit structures to provide a sequence of the structures in a stack-like formation. Electrical connections are formed between adjacent circuit structures in the sequence. A connector region on each circuit structure includes a distal portion extending away from the major surface, with distal portions of connector regions of adjacent structures spaced apart from one another. A first wiring pattern extends from the major surface to the distal portion of the connector region. The plurality of circuit structures are configured to provide a second wiring pattern including at least some of the electrical connections formed between the circuit structures, extending from one or more of the first wiring patterns to multiple of the transducer elements.
|
