| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and apparatus for maximizing the exposure time of a substrate in a lithography apparatus, and/or minimizing the increase of the occupying area of the lithography apparatus when a large substrate is exposed. <P>SOLUTION: The lithography method and apparatus include an illuminating system 124 for supplying a radiating beam, a pattern forming device 104 for forming a pattern in a beam 110, and a projecting system 108 for projecting a patterned beam onto the target portion of a substrate 114. A measuring system is provided adjacently to the projecting system in order to align the projecting system with the substrate. Two or more movable chucks support the substrates respectively, and are constituted so as to move between a loading device and the projecting system. The chucks is movable independently. While one substrate moves between the loading system and the projecting system, the other substrate passes through the measuring system and the patterned beam. <P>COPYRIGHT: (C)2010,JPO&INPIT |
