| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a very thin wire for bonding which is stable, being suppressed for wire bending or leaning, and allowing electrode pads bonding with interval of ≤60 μm, with no special inspection or additional selection. <P>SOLUTION: Gold alloy thin wire for bonding contains Cu by 0.01-2.0 mass%, Pd by 0.01-1.0 mass%, at least one kind from among Zn, Al, Ga, In, Tl, Ge, and Sn by 0.0001-0.002 mass%, and at least one kind from among Ca, Be, Mg, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, and Gd by 0.0001-0.01 mass%, with remaining portion consisting of Au whose purity is 99.99 mass% or higher and inevitable impurities. In its manufacturing method, continuous molding is performed under the condition in which an interface relative movement speed between melt and solidified portion is 20 mm/min or faster. <P>COPYRIGHT: (C)2010,JPO&INPIT |
