| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealing mold and a resin sealing method, which can improve the yield of a semiconductor device by reducing resin filling defects. Ž<P>SOLUTION: The resin sealing mold includes: a cavity part 17 for sealing the upper part of a wiring substrate 21, which is mounted with a semiconductor chip 20, with a resin; a gate part 13 provided at the end of the one side of the cavity part 17 to allow a resin to flow into the cavity part 17; and a lower part dummy cavity part 33 disposed below the wiring substrate 21 to hold a molten resin R' flowing into the lower part dummy cavity part 33 through a plurality of through-holes 23 provided partially in the wiring substrate 21 from the end side of the other side of the cavity part 17. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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