发明名称 |
Silphenylene-bearing polymer, photo-curable resin composition, patterning process, and substrate circuit protective film |
摘要 |
A photo-curable resin composition comprising a silphenylene-bearing polymer having a Mw of 3,000-500,000 can be processed to form patterned films having a widely varying thickness from submicron to more than 20μm. The cured films have good adhesion to substrates, heat resistance, electrical insulation and chemical resistance.
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申请公布号 |
US7785766(B2) |
申请公布日期 |
2010.08.31 |
申请号 |
US20080022685 |
申请日期 |
2008.01.30 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
KATO HIDETO;ASAI SATOSHI |
分类号 |
G03F7/038;C08G77/52;G03F7/20;G03F7/30;G03F7/40 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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