| 摘要 |
A first pad (121) has first and second sub-pads (121a,121b) that are connected to each other by a connection section extending in a manner overlapping with a mounted circuit chip (13B) and that are connected to two terminals formed at two positions on a diagonal of a lower surface of the circuit chip, respectively. The second pad (122) has third and fourth sub-pads (122a,122b) that are connected to each other via a route bypassing the mounted circuit chip and that are connected to two terminals formed at two positions on the other diagonal of the lower surface of the circuit chip, respectively. |
