METHOD OF CLAMPING A SUBSTRATE AND CLAMP PREPARATION UNIT

摘要

The invention relates to a method of clamping a substrate (22) on a surface of a substrate support structure (23). First, a liquid is applied on a surface of the substrate support structure. The surface is provided with a plurality of contact elements. The liquid is applied such that the contact elements are fully covered by a liquid layer. Then the substrate is provided and placed onto the liquid layer. Finally, liquid underneath the substrate is removed such that the substrate rests on the plurality of contact elements and is clamped by means of a capillary clamping force exerted by a capillary layer of the liquid between the substrate and the surface of the substrate support structure.