发明名称 PLASMA TREATMENT EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide plasma treatment equipment capable of maintaining plasma generation stably and generating active species speedily when performing plasma processing to a workpiece where processing regions are set discontinuously. <P>SOLUTION: The plasma treatment equipment 1 includes a pair of electrodes 2 and 3, a power supply circuit 7, a gas supply means 8, a plasma injection port 5, and a control means 170. The apparatus can be switched to either a non-processing mode in which plasma is generated and maintained by cutting off the supply of a treatment gas in a state the gas supply means 8 supplies a carrier gas to a plasma generation space 30 by the control means 170 or a processing mode in which the treatment gas is activated to generate active species by supplying a mix gas of the carrier gas and treatment gas to the plasma generation space 30 and the active species is blown out from the plasma injection port 5 to plasma-treat the surface 101 of the workpiece 10. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010186749(A) 申请公布日期 2010.08.26
申请号 JP20100055148 申请日期 2010.03.11
申请人 SEIKO EPSON CORP 发明人 ASUKE SHINTARO
分类号 H05H1/24;C23C16/513;C23F4/00;H01L21/3065;H01L21/31 主分类号 H05H1/24
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