| 摘要 |
A semiconductor package includes a first package and a second package, a connection terminal disposed between the first and second packages and including a first solder ball and a second solder ball that are vertically stacked, a solder passivation layer with which a surface of at least one of the first and second solder balls is coated, and a ring-shaped short prevention part surrounding a coupling portion between the first and second solder balls.
|
