发明名称 |
IMPROVED LOAD CUP SUBSTRATE SENSING |
摘要 |
Embodiments of the present invention generally provide a load cup used in the transfer of substrates in a chemical mechanical polishing system. The load cup includes an improved substrate edge sensing mechanism to ensure a substrate is present and correctly positioned in the load cup for transfer to a polishing head. In one embodiment, a lever actuated edge sensing mechanism is provided. In one embodiment, the edge of a substrate contacts a lever, which contacts a sensor to detect that the substrate is present and correctly positioned for exchange with a polishing head. Embodiments of the present invention provide reliable detection, while reducing contact with the feature side of the substrate during substrate transfer. |
申请公布号 |
WO2010062840(A3) |
申请公布日期 |
2010.08.26 |
申请号 |
WO2009US65433 |
申请日期 |
2009.11.23 |
申请人 |
APPLIED MATERIALS, INC.;LISCHKA, DAVID JAMES;TERRY, THOMAS LAWRENCE |
发明人 |
LISCHKA, DAVID JAMES;TERRY, THOMAS LAWRENCE |
分类号 |
H01L21/304;H01L21/66 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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