| 摘要 |
PROBLEM TO BE SOLVED: To establish an analysis technology for predicting the crack of particles in performing connection molding and inter-substrate conductivity by thermal stress analysis under the input conditions of the temperature change and electrode moving speed of resin and particles calculated by the hot fluid analysis of resin materials containing particles. SOLUTION: The deformation quantity of particles is calculated from an inter-electrode interval calculated by a hot fluid analysis, and a load calculated by subtracting a load corresponding to the deformation quantity of particles from a load for moving electrodes is used as a load for moving the electrodes of the next time step. A process that resin materials flow while particles are deformed is predicted by the analysis of fluid, and the experiment result of a temperature and an elasticity rate for the resin materials and particles are input, and a result including the temperature change of the resin materials and particles and the moving speed of the electrodes calculated by the hot fluid analysis is used as the input conditions of the thermal stress analysis. Thus, it is possible to calculate the deformation shape of the particles and electrodes in detail, and to predict the crack of the particles in the case of connection molding and inter-substrate conductivity of the like. COPYRIGHT: (C)2010,JPO&INPIT
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