ORGANIC ELECTRONIC CIRCUIT

摘要

The invention relates to an organic electronic circuit (1) in the form of a multi-layered film body and to a method for the production thereof. The multi-layered film body has a substrate layer (2), a first electrically conductive functional layer (3), an electrically semi-conductive functional layer (4), an isolation layer (5) and a second electrically conductive functional layer (6). The organic electronic circuit (1) has two or more sections (20, 21). At least one first section (20) of the two or more sections (20, 21) is designed as an interconnection assembly (80). There is a plurality of structures (3a) repeating in a preferred direction in said at least one first section (20) that are each shaped in the first electrically conductive functional layer (3), that each are covered by the isolation layer (5) in a central first zone (30) and that each are not covered by the isolation layer (5) in the second zones (31, 32) arranged on both sides of the central first zone (30). At least one second section (21) of the two or more sections (20, 21) is designed as an interconnection assembly (81). A plurality of structures (3b) repeating in a preferred direction is furthermore shaped in said at least one second section (21) in the first electrically conductive functional layer (3). Said structures (3b) arranged in a central first zone (40) are covered by the electrically semi-conductive functional layer (4) and/or the isolation layer (5). Said structures (3b) in at least one second zone (41, 42) arranged neighboring a section are not covered by the isolation layer (5). The second electrically conductive functional layer (6) has at least one first region (50) wherein the second electrically conductive functional layer (6) partially covers at least one structure (3a) of the first electrically conductive functional layer (3) in the at least one section (20) designed as an interconnection assembly (80) and at least one structure (3b) of the first electrically conductive functional layer (3) in the at least one section designed as an electronic assembly (81) forming one or more electrically conductive connections (64, 65, 66). The second electrically conductive functional layer (6) has at least one second region (51) forming an electronic component wherein the second electrically conductive functional layer (6) partially covers the at least one second section (21) designed as an electronic assembly (81).