| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an ultrasonic probe which improves oscillation characteristic of an ultrasonic imaging apparatus and makes focusing better, so that a clear image can be obtained, and to provide the ultrasonic imaging apparatus and its manufacturing method. <P>SOLUTION: The ultrasonic probe includes: a back surface block 310 which has a specified thickness; a flexible printed circuit board 320 which is layered in such a state as to surround the top surface and the side surfaces of the back surface block 310, and on which a wiring pattern is installed; a piezoelectric wafer 350 which is layered over the top surface of the flexible printed circuit board 320, and has upper and lower electrodes on the both sides respectively, and on which a plurality of second grooves are formed; an electrode plate 360 for grounding which is layered on the top surface of the piezoelectric wafer 350, is jointed to the upper electrode, and is connected with the grounding layer of the flexible printed circuit board; a sound adjustment layer 370 which is layered on the top surface of the electrode plate for grounding; and a sound lens which is bonded to the top surface of the sound adjustment layer 370. Also, a plurality of slots which are orthogonal to the second grooves are formed from the sound adjustment layer to the upper end of the back surface block 310. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
