发明名称 DEVICE AND METHOD FOR MAKING THIN SLICE
摘要 PROBLEM TO BE SOLVED: To cut a thin slice in desired thickness with high precision. SOLUTION: In a thin slice making device, a control unit is operated so that a support and a cutter 3 are relatively moved forward by a moving means after an embedding block B is preparatorily humidified by a humidification means 6, the embedded block is preparatorily cut by the cutter and subsequently subjected to main humidification by the humidification means, the support and the cutter are relatively moved forward at the same speed as that in preparatory cutting by the moving means after they are relatively moved forward by slice thickness using an adjusting means and the embedding block is subjected to main cutting by the cutter to make the thin slice. The control unit makes the time from the completion of the preparatory humidification to the start of the preparatory cutting the same as the time from the completion of the main humidification to the start of the main humidification and performs both the preparatory humidification and the main humidification under the same humidification condition. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010185789(A) 申请公布日期 2010.08.26
申请号 JP20090030251 申请日期 2009.02.12
申请人 SEIKO INSTRUMENTS INC 发明人 MIYATANI TATSUYA;KIJIMA YUKIMITSU;NONOYAMA MASATOSHI
分类号 G01N1/06;G01N1/28 主分类号 G01N1/06
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