发明名称 |
DOUBLE-FACED PRESSURE-SENSITIVE ADHESIVE SHEET USED FOR ELECTRONIC COMPONENTS AND PRODUCING METHOD THEREOF |
摘要 |
A double-faced pressure-sensitive adhesive sheet used for electronic components is provided. The double-faced pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer; a first release sheet including at least a first release agent layer attached to one surface of the pressure-sensitive adhesive layer; and a second release sheet including at least a second release agent layer attached to the other surface of the pressure-sensitive adhesive layer. The first release agent layer is mainly constituted of an olefin-based resin and the second release agent layer is mainly constituted of a diene-based polymer material. When an peeling force of the first release sheet with respect to the pressure-sensitive adhesive layer is defined as“X”[mN/20 mm] and an peeling force of the second release sheet with respect to the pressure-sensitive adhesive layer is defined as“Y”[mN/20 mm], the following relation is satisfied: Y−X≧50. The pressure-sensitive adhesive layer, the first release agent layer and the second release layer contain substantially no silicone compound and substantially no halogen compound.
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申请公布号 |
US2010215881(A1) |
申请公布日期 |
2010.08.26 |
申请号 |
US20080682406 |
申请日期 |
2008.09.25 |
申请人 |
LINTEC CORPORATION |
发明人 |
MIYATA SOU;BEPPU SHIORI;NISHIDA TAKUO;SUGIZAKI TOSHIO |
分类号 |
B32B33/00;B32B9/00;B32B37/00 |
主分类号 |
B32B33/00 |
代理机构 |
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地址 |
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