INSULATING CIRCUIT BOARD, INVERTER DEVICE, AND POWER SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an insulating circuit board with high insulation reliability, and related technique using the insulating circuit board. SOLUTION: In the insulating circuit board 12 where a conductor circuit 4 is formed on a metal base substrate 1 with an insulating layer interposed, the insulating layer 2 is formed by laminating a plurality of layers each including at least a composite insulating layer 2a forming an interface with the conductor circuit 4 and formed by dispersing an inorganic filler 8 in an insulating resin 7, and a resin single-substance insulating layer 2b which does not contain the inorganic filler 8. COPYRIGHT: (C)2010,JPO&INPIT