摘要 |
<p>The invention relates generally to microprocessor cards and their process of manufacturing. It relates more particularly to microprocessor mini-cards, such as mini-cards of the type SD, or micro-SD, or MMC, or plug-in, or mini-UICC or memory sticks etc...The method of manufacturing a microprocessor mini-card according to the invention comprises the step of transfer molding a resin (27) onto the component face (23) of a tape (20), for simultaneously encapsulating components (24) and connections (25), and forming the card body, and the step of cutting the transfer-molded resin (27) and the tape (20), in order to obtain a mini-card having dimensions compliant with standardized tolerances.</p> |