发明名称 ELECTRONIC DEVICE FORMED BY MOLDING, METHOD AND MOLD FOR MANUFACTURING THE SAME, ELECTRONIC APPLICATION BY USING THE SAME
摘要 PURPOSE: The manufacturing process can be simplified by into one body forming molding the casing molding unit forming the electronic device for being molded and shaped, and the manufacturing method thereof and making mold and the applied electronic device is the driving part mold casing part and outer tube. CONSTITUTION: The driving part and microphone are mounted in substrate. The driving part is molded and shaped to the resinous material so that in the driving part mold casing part(14), the drive of the driving part possible. In order to cover the substrate whole with the driving part mold casing part it is molded and shaped and the casing molding unit(12) forms the overall look. In the protective cap(40) is the top of the substrate, the driving part or microphone is covered. And it prevents from the driving part or microphone being directly molded.
申请公布号 KR20100093289(A) 申请公布日期 2010.08.25
申请号 KR20090012409 申请日期 2009.02.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, DUK WOO;SUNG, JAE SUK;LEE, DAE KYU;YANG, TAE SEOK;JEON, YOUNG HO
分类号 H05K5/00;G11B20/00 主分类号 H05K5/00
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