| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a miniaturizable electronic component device with a simple structure, and formed by considering improvement of transmission characteristics by influence of a high-frequency ground current. Ž<P>SOLUTION: This electronic component device includes: a dielectric substrate 1; a grounded conductor 2 formed on the back surface of the dielectric substrate; a transmission line installed on the front surface of the dielectric substrate through a space region; an active element 6 mounted on the front surface of the dielectric substrate in the space region of the transmission line for amplifying power of a microwave signal passing through the transmission line; grounding leads 6c of the active element extending from the active element and projecting to recede away from the transmission line; first front surface ground conductors 5 electrically connected to the grounding leads by electric connection means and formed on the front surface of the dielectric substrate; second front surface ground conductors 7 electrically connected to the first front surface ground conductors through patterns on the transmission line side of the first front surface ground conductors; through-hole parts 8 formed on the second front surface ground conductors and electrically connected to the grounded conductor; and dams 9 formed on the dielectric substrate front surface for preventing the electric connection means from impregnating into the through-hole parts. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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