POLISHING TOOL OF CONTACT PIN FOR ELECTRIC CHARACTERISTIC TEST OF SEMICONDUCTOR IC, METHOD FOR MANUFACTURING THE POLISHING TOOL, AND ELECTRIC CHARACTERISTIC TEST METHOD USING THE POLISHING TOOL

摘要

<P>PROBLEM TO BE SOLVED: To provide a polishing tool capable of performing correctly semiconductor IC characteristic determination by removing effectively a solder scrap adhering to a contact pin used for a test performed in a form of a lead frame or a test after cutting the lead frame rectangularly, in an electric characteristic test of the semiconductor IC. Ž<P>SOLUTION: An irregular face is formed on a lead surface of the lead frame, and a solder scrap or the like adhering to a contact pin surface to be brought into contact with the irregular face is removed, to thereby clean the contact pin surface. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž