| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cooling structure for a semiconductor that is improved in cooling efficiency with simple constitution, and to provide a method of manufacturing the cooling structure. <P>SOLUTION: The cooling structure 10 for the semiconductor has a heat sink 8 arranged on the semiconductor 2 mounted on a substrate 1. Further, a heat-conductive heat spreader 6 is fitted on an upper surface of the semiconductor 2 through a heat-conductive member 5. Furthermore, the heat sink 8 is fitted to an upper surface 6c of the heat spreader 6 through heat-conductive grease 7. Here, the heat spreader 6 comprises a plurality of plate-like members 6a, which preferably each have a lower surface inclined in conformity with the shape of the upper surface of the semiconductor 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
