发明名称 |
Electronic Devices in Plastic |
摘要 |
<p>A method of forming electronic components in which a thermoplastic substrate is embossed to create a recess for electronic components; the electronic component is placed in the recess; electrical connections and circuitry are deposited over the components on the thermoplastic substrate; and a cover sheet of thermoplastic material is bonded over the circuitry. The process may also be carried out in reverse order. The apparatus used consists of a hot embossing machine having a former shaped for each particular circuit to be assembled; a pick and place machine with standard reel loading of components; and a screen printer for printing the conductive ink circuitry or a station for adhering conductive tape or preprinted film.</p> |
申请公布号 |
AU2009233620(B2) |
申请公布日期 |
2010.08.19 |
申请号 |
AU20090233620 |
申请日期 |
2009.10.30 |
申请人 |
GRIFFITH UNIVERSITY |
发明人 |
DAVID VICTOR THIEL;NEELI MADHUSUDANRAO |
分类号 |
H05K1/18;H05K3/12;H05K3/14;H05K13/00 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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