发明名称 SURFACE-TREATED COPPER FOIL, METHOD FOR MANUFACTURING THE SAME AND COPPER-CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a surface-treated copper foil which can make a conductor pattern finer and also reliably have a stronger bonding force; a method for manufacturing the same; and a copper-clad laminate. SOLUTION: The surface-treated copper foil comprises: a copper foil substrate 1; a roughened layer 2 which is formed of copper or copper alloy and is provided on the copper foil substrate 1, and in which a part of carbon fibers that have been mixed in the roughened layer projects from the surface; and a post-treated layer 8 which is provided on the roughened layer 2 so as to increase the chemical bonding force to the outside insulative substrate 7 and includes a rust-preventing layer 3, a zinc-plated layer 4, a chemical conversion coating layer 5 of chromium and a silane coupling treated layer 6. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010180454(A) 申请公布日期 2010.08.19
申请号 JP20090025268 申请日期 2009.02.05
申请人 HITACHI CABLE LTD 发明人 HASHIBA TOSHIO;TAGA KATSUTOSHI
分类号 C25D7/06;C23C28/00;C25D15/02;H05K1/09 主分类号 C25D7/06
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