发明名称 MULTIPLE PATTERNING WIRING BOARD, AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board possessing a plurality of wiring boards having a plurality of surface electrodes coated with the same or different kind of metal plating individually and minutely on the surface or the like of a substrate body, and to provide a method of efficiently manufacturing the same. Ž<P>SOLUTION: This multiple patterning wiring board 1 includes: a base substrate 2 formed of an insulating layer possessing a plurality of substrate bodies k of the wiring boards which become product units along the plane direction; a plurality of terminals for external connection that are formed along the thickness direction on the side face 6 of the base substrate 2, and a first wiring layer 24 and a second wiring layer 26 built in for every substrate body k and formed as mutually independent circuits. The plurality of terminals for external connection are respectively provided with a first terminal 10a for external connection that can be conductive only to the first wiring layer 24 and a second terminal 10b for external connection that can be conductive only to the second wiring layer 26. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010183117(A) 申请公布日期 2010.08.19
申请号 JP20100119225 申请日期 2010.05.25
申请人 NGK SPARK PLUG CO LTD 发明人 WASHINO JUNICHI;WAKAKO HISASHI
分类号 H05K3/00;H05K1/02 主分类号 H05K3/00
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