| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology capable of simply manufacturing a semiconductor device on which semiconductor packages are mounted. <P>SOLUTION: A first semiconductor package is adhered and held to a palette having adhesiveness, a second semiconductor package is mounted on the first semiconductor package adhered and held to the palette, and the palette has a placement table which supports the first semiconductor package, and an adhesive member which is provided on the placement table to adhere and hold the first semiconductor package. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
