| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a surface-mounted light emitting element for realizing flip chip bonding with short assembly time. <P>SOLUTION: A light emitting element wafer is press-fitted onto a collective circuit board and flip chip bonding is performed. The light emitting element wafer and the collective circuit board are vertically and horizontally diced into prescribed chip sizes and light emitting element chips with circuit board are formed. An interval between the diced light emitting element chips with circuit board is expanded to a prescribed size. A fluorescence resin member containing a fluorescence material absorbing light emitted from the light emitting element chip and emitting fluorescence is formed to cover the light emitting chip. The fluorescence resin member is vertically, horizontally and fully diced to be divided into each light emitting element. <P>COPYRIGHT: (C)2010,JPO&INPIT |
