METHOD OF CLOSING AT LEAST ONE VOID FOR MICROELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of closing at least one void to capsulate a microelectronics device or intended to be a part of the microelectronics device. SOLUTION: The method includes: (a) the step of manufacturing voids in a first substrate including a first layer where an opening for forming a passage to the voids is transversed; (b) the step of manufacturing a binder portion around the opening on the surface of the first layer disposed on the opposite side of the voids; (c) the step of manufacturing a fusible material portion on a second substrate by depositing the fusible material on the second substrate and using a mask; (d) the step of disposing the fusible material portion by bringing it into contact with the binder portion; (e) the step of forming a plug for the opening bonded to the binder portion by dissolving the fusible material, followed by solidification; and (f) the step of separating the plug and the second substrate. COPYRIGHT: (C)2010,JPO&INPIT