| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an etching apparatus and an etching method, which can suppress influence of heat to a workpiece and can work a size different in a diameter and width of light that a light source emits. Ž<P>SOLUTION: The apparatus is provided with a light source part 3 irradiating an irradiation region R being a part of an interface F between the workpiece (substrate S) and an etching medium (etching gas G) with light activating the etching medium. The light source part 3 includes a light control part 32 controlling a cross section of light. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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