发明名称 Probe for testing semiconductor devices with features that increase stress tolerance
摘要 A novel probe design is presented that increases a probe tolerance to stress fractures. The probe includes a base, a torsion element connected to the base, and a second element connected to the torsion element through a union angle. The union angle includes an interface between the torsion element and the second element, and the edge of the interface is shaped to diffuse stress. What is further-disclosed are three features that increase stress tolerance. These features include a various union angle interface edge shapes, pivot cutouts and buffers.
申请公布号 US7772859(B2) 申请公布日期 2010.08.10
申请号 US20080042295 申请日期 2008.03.04
申请人 TOUCHDOWN TECHNOLOGIES, INC. 发明人 KHOO MELVIN;TEA NIM;HU TING;AN ZHIYONG
分类号 G01R31/02 主分类号 G01R31/02
代理机构 代理人
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