| 摘要 |
<p>PURPOSE: A light emitting device is provided to prevent a crack and breach which are generated in a substrate. CONSTITUTION: A solder bonding layer(9) is arranged on a conductive board(10). A diffusion barrier layer(8) is arranged on the solder bonding layer. A bonding layer(7) is arranged on a diffusion barrier. The ohmic contact layer(ohmic contact layer)(6) is arranged on the bonding layer. Light emitting semiconductor layers(1, 2, 3, 4, 5) are arranged on the ohmic contact layer. The solder bonding layer, the diffusion barrier, and the bonding layer includes metal and alloy having a young's modulus value of less than 200GPa.</p> |
