| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component package that can increase the number of electronic component packages to be taken out of a wafer, allows even electronic components having functional surfaces on both the sides to easily, without fail, and electrically conduct electricity, and can be miniaturized as compared with before. SOLUTION: The electronic component package 10 includes the electronic component 11, and a casing 13 formed by jointing a plurality of components so that the electronic component is covered. In the electronic component package, an IC for signal processing is formed on a surface crossing the function surfaces 11a, 11b of the electronic component of the casing 13, and the function surfaces 11a, 11b of the electronic component and junction surfaces 21a, 21b among the components 21, 22, 23 of the casing are disposed so that they cross mutually. COPYRIGHT: (C)2010,JPO&INPIT |
