| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of mounting a shield frame which can reliably prevent improper soldering when the shield frame has such a structure as to be soldered to a printed circuit board, and also the shield frame. Ž<P>SOLUTION: When the shield frame having a ceiling and side surfaces is soldered to a printed circuit board with use of a reflow furnace, the shield frame having a horizontal ceiling surface as a desired shape is made of a shape memory alloy having a horizontal ceiling surface as a desired shape, a part of the printed circuit board for the shield frame to be mounted thereon is applied with solder, and the shield frame is placed on the printed circuit board, and then soldered to the printed circuit board in a reflow furnace. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
