发明名称 Method for Fabricating Semiconductor Memory Device
摘要 A method for fabricating a semiconductor memory device includes: forming a lower conductive layer over a semiconductor substrate; forming an insulation layer over the lower conductive layer; etching the insulation layer to form a contact hole that exposes a portion of the lower conductive layer; forming a contact plug in the contact hole; doping the contact plug by performing a plasma doping process while varying a temperature of regions the semiconductor substrate; and forming an upper conductive layer connected with the lower conductive layer through the contact plug.
申请公布号 US2010190326(A1) 申请公布日期 2010.07.29
申请号 US20090489019 申请日期 2009.06.22
申请人 HYNIX SEMICONDUCTOR INC. 发明人 JOUNG YONG SOO;JIN SEUNG WOO;LEE AN BAE;JOO YOUNG HWAN
分类号 H01L21/28;H01L21/768 主分类号 H01L21/28
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