发明名称 |
METAL BASE CIRCUIT BOARD AND ITS PRODUCTION PROCESS |
摘要 |
To provide a metal base circuit board excellent in heat dissipation properties, which remarkably reduces malfunction time of a semiconductor which occurs when a hybrid integrated circuit is operated at a high frequency. A metal base circuit board to be use for a hybrid integrated circuit, comprising circuits provided on a metal plate via an insulating layer (A, B), a power semiconductor mounted on the circuit and a control semiconductor to control the power semiconductor, provided on the circuit, wherein a low capacitance portion is embedded under a circuit portion (pad portion) on which the control semiconductor is mounted, preferably, the low capacitance portion is made of a resin containing an inorganic filler and has a dielectric constant of from 2 to 9. Fig. 1-3 |
申请公布号 |
SG162619(A1) |
申请公布日期 |
2010.07.29 |
申请号 |
SG20080029019 |
申请日期 |
2004.04.15 |
申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
YONEMURA, NAOMI;TSUJIMURA, YOSHIHIKO;YASHIMA, KATUNORI |
分类号 |
H01L21/48;H01L23/14;H01L23/373;H01L23/498;H01L23/66;H01L25/16;H05K1/02;H05K3/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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