发明名称 |
Semiconductor device, method for manufacturing semiconductor device, and electric equipment system |
摘要 |
A semiconductor device of the present invention includes: a plurality of semiconductor chips each having a chip size package structure; and a substrate bonded via an adhesive material to an opposite surface in each of the plurality of semiconductor chips that is opposite to a connection surface that is provided with solder balls (external connection terminals). Thereby, the plurality of semiconductor chips are connected to each other.
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申请公布号 |
US7763960(B2) |
申请公布日期 |
2010.07.27 |
申请号 |
US20070852672 |
申请日期 |
2007.09.10 |
申请人 |
PANASONIC CORPORATION |
发明人 |
MORISHITA TATSUYA;ISHIKAWA OSAMU |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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