发明名称 Integrated circuit and methods of manufacturing a contact arrangement and an interconnection arrangement
摘要 A contact arrangement is manufactured by providing a substrate that includes first regions that are arranged along a row direction and a second region. An interlayer is provided that covers the first regions and the second region. A buried mask including a first trim opening above the first regions is provided. A top mask including first template openings is provided, where each first template opening is arranged above one of the first regions. A second template opening is provided above the second region. The fill material and the interlayer are etched to form contact trenches above the first regions and the second region. Substrate area efficient chains of evenly spaced contacts are provided.
申请公布号 US7763987(B2) 申请公布日期 2010.07.27
申请号 US20070679295 申请日期 2007.02.27
申请人 QIMONDA AG 发明人 BACH LARS
分类号 H01L21/4763 主分类号 H01L21/4763
代理机构 代理人
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