| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of continuously performing film formation processing. SOLUTION: A film forming device includes wafer holders configured to hold semiconductor wafers, a conveyance means for conveying a plurality of wafer holders sequentially carried in a heating pipe from a carry-in opening to a carry-out opening while supporting them in a series, a first gas supply means for supplying a gas into the heating pipe, and a gas discharging means for discharging the gas in the heating pipe to the outside. Each wafer holder has a frame surrounding a held semiconductor wafer, and the plurality of wafer holders supported by the conveyance means in series have their frames connected to form a reaction space extending from the carry-in opening to the carry-out opening. The first gas supply means is configured to supply a first kind of gas capable of forming a film even by itself when thermally decomposed to the reaction space formed inside the frames, and the gas discharging means is configured to discharge the gas in the reaction space formed inside the frames to the outside. COPYRIGHT: (C)2010,JPO&INPIT |
