| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for transferring a plurality of wafers for vacuum processing. SOLUTION: According to this vacuum processing apparatus, first and second delivering vacuum columns 112a and 112b are connected to a processing vacuum column 113, respectively, substrates 31a and 31b are disposed on first and second trays 21a and 21b disposed inside the respective delivering vacuum columns 112a and 112b, respectively, and the substrates on the first and second trays 21a and 21b are alternately transferred from the respective delivering vacuum columns 112a and 112b to the processing vacuum column 113 for vacuum processing. The respective trays 21a and 21b do not emerge outside of these vacuum columns 112a, 112b, and 113, and further the substrates are output and input from a plurality of delivering vacuum columns to the processing vacuum column 112. COPYRIGHT: (C)2010,JPO&INPIT
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