摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring circuit board in which a cover insulating layer can be precisely disposed for a conductor layer and the wiring circuit board can be obtained easily in a short time: and to provide a method for manufacturing the wiring circuit board. Ž<P>SOLUTION: The manufacturing method includes: the steps of preparing a base insulating layer 2 and a conductor layer 3 formed on the layer 2 and equipped with a wiring circuit pattern 5 and an irradiated portion 6 formed independently from the pattern 5; forming a light absorbent layer 15 containing a near-infrared absorbent on the upper surface of the irradiated portion 6; placing a double-layer sheet adhesive layer 10 made of an adhesive layer 10 and an insulating film 9 on the base insulating layer 2; irradiating the irradiated portion 6 with a laser beam 13 as a near-infrared ray to locally heat the adhesive layer 10 to temporarily press-fit the layer 10; principally press-fitting it then to bond the insulating film 9 via the adhesive layer 10, thereby forming a cover insulating layer 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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