| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate coating method for lithography which enables pattern formation that simultaneously attains high resolution by an improvement in missing property and outgas reduction, by inhibiting water repelling on a resist surface before development due to a hydrophilic-hydrophobic rugged structure and allowing development to proceed evenly and uniformly, particularly, in electron beam, X-ray or EUV lithography in an ultrafine region, and to provide a positive resist composition used in the method. <P>SOLUTION: The substrate coating method for lithography includes the steps of coating the top of a substrate with a film in a lithography process and disposing a topcoat layer on the film, wherein the film is formed using an actinic ray-sensitive or radiation-sensitive resin composition that contains a resin (P), having a repeating unit (A) which decomposes due to irradiation with actinic rays or radiation, and which generates an acid. <P>COPYRIGHT: (C)2010,JPO&INPIT |
