METHOD FOR MANUFACTURING PACKAGE, WAFER BONDED BODY, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIO-CONTROLLED CLOCK

摘要

Disclosed is a method for manufacturing a package wherein contents are encapsulated. The method has a step of forming cavities in a plurality of package forming regions on a first wafer; a step of bonding the first wafer and a second wafer to each other, while arranging the contents in the cavities; and a step of irradiating the bonded wafers with laser beams so as to divide the package into pieces. In the cavity forming step, outside the package forming regions on the outermost circumference of the first wafer, dummy cavities are formed.