| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means for efficiently cooling a semiconductor element of a semiconductor device in which a package substrate, a semiconductor element, and a mounting substrate are stacked sequentially. <P>SOLUTION: In the semiconductor device, a package substrate 11, a semiconductor element 131, and a mounting substrate 2 are sequentially stacked, the package substrate and the semiconductor element are electrically connected together via a primary connection bump 122; a heat-receiving part 31 of a liquid cooling module for cooling the semiconductor element that uses a liquid coolant is installed between the semiconductor element and the mounting substrate; and a plurality of secondary connection bumps 15 are installed between the package substrate and the mounting substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
