| 摘要 |
Provided is an imaging device manufacturing method, which has the step of forming a plurality of imaging elements on one surface of a silicon wafer, the step of sealing a light receiving pixel portion for each imaging element by an imaging optical system, the step of cutting the silicon wafer into the individual imaging elements, the step of placing the cut imaging elements on a substrate, the step of connecting the substrate and the imaging elements electrically, the step of molding the substrate, the imaging optical system and the imaging elements integrally by a mold having identification marks with respect to each imaging element, and the step of cutting and separating the molded substrate into each every imaging element.
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