发明名称 Method for packaging micro electromechanical systems microphone
摘要 A method for packaging micro electromechanical systems (MEMS) microphone has steps of providing a base, arranging and mounting multiple microphone component assemblies on the base, providing a frame, mounting the frame on the base, forming multiple microphone units, providing a cover; mounting the microphone units on the cover and forming multiple MEMS microphones. Therefore, the MEMS microphones can be produced once in large quantities to save production time and costs.
申请公布号 US2010175242(A1) 申请公布日期 2010.07.15
申请号 US20090319742 申请日期 2009.01.12
申请人 TONG HSING ELECTRIC INDUSTRIES LTD. 发明人 WU KUO-JUNG
分类号 H04R31/00 主分类号 H04R31/00
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