| 摘要 |
<p>A multilayered printed circuit board and a fabricating method thereof are disclosed. A method that includes repeating processes of forming at least one circuit pattern, and at least one insulation layer that covers the circuit pattern, over a carrier and interconnecting circuit patterns on different layers with vias; stacking a metal stiffener over the insulation layer; repeating processes of forming at least one insulation layer and at least one circuit pattern over the stiffener and interconnecting circuit patterns on different layers with vias; and removing the carrier, can be used to reduce warpage in the board and improve workability.</p> |
