发明名称 METHOD AND APPARATUS FOR FABRICATING IB-IIIA-VIA2 COMPOUND SEMICONDUCTOR THIN FILMS
摘要 Methods and apparatus for fabricating IB-IIIA-VIA2 compound semiconductor thin films are provided. A method for fabricating IB-IIIA-VIA2 compound semiconductor thin films includes providing a substrate with a precursor film thereover, wherein the precursor film includes elements of group IB and group IIIA. An annealing process is performed on the substrate and the precursor film thereover and forms a group IB-IIIA alloy thin film over the substrate. A surface treatment is performed by transporting ionized group VIA elements to the group IB-IIIA alloy thin film to react therewith to thereby form an IB-IIIA-VIA2 compound semiconductor thin film.
申请公布号 US2010173482(A1) 申请公布日期 2010.07.08
申请号 US20090502140 申请日期 2009.07.13
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 CHUANG CHIA-CHIH;HUANG YU
分类号 H01L21/20;C23C14/54 主分类号 H01L21/20
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