| 摘要 |
PROBLEM TO BE SOLVED: To provide a microbubble generating device and a silicon wafer cleaning device which supply microbubbles of a small bubble size at a high cleaning effect to the outside, downsize the device, and enhance the degree of freedom in device layout. SOLUTION: This microbubble generating device 1 includes a microbubble generating mechanism 10 and a leading conductor 20 for leading the microbubbles to the outside. The leading conductor 20 includes a widening part 21 and a tube part 22, and in the leading conductor 20, the widening part 21 is mutually interconnected with the tube part 22. The widening part 21 has a hollow cylindrical shape with an axis z being used as a central axis, and has bases 23 and 24 and a cylindrical circumferential face 25, and the widening part 21 is interconnected with a blast nozzle 11 of the microbubble generating mechanism 10 via one base 23 of the widening part 21 and is interconnected with the tube part 22 via the other base 24. An area of a section perpendicular to the flow path axis z of the microbubbles of the widening part is greater than that perpendicular to the flow path axis z of the tube part 22. COPYRIGHT: (C)2010,JPO&INPIT
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