| 摘要 |
<p>PURPOSE: A method for managing process fabricating a semiconductor device is provided to minimize the contamination of a wafer from an ion or a metal by subdividing a semiconductor manufacturing process and managing it. CONSTITUTION: A processing of semiconductor device is comprised of a metal process and a non-meta process. The non-metal process is divided into a phosphorous process and non phosphorous process. An N-type wafer is processed through the phosphorus process based on a wafer type. A P-type wafer is processed through the non phosphorus process based on a wafer type. A silicide is formed in order to form a multi layer metallization.</p> |
